BA679-GS08
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Silver, Tin |
| Mount | Surface Mount |
| Package / Case | DO-213AC, MINI-MELF, SOD-80 |
| Number of Pins | 2 |
| Diode Element Material | SILICON |
| Operating Temperature | 125°C TJ |
| Packaging | Tape & Reel (TR) |
| Published | 2016 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| Termination | Solder |
| ECCN Code | EAR99 |
| HTS Code | 8541.10.00.80 |
| Technology | POSITIVE-INTRINSIC-NEGATIVE |
| Terminal Position | END |
| Terminal Form | WRAP AROUND |
| Pin Count | 2 |
| Number of Elements | 1 |
| Max Current Rating | 50mA |
| Element Configuration | Single |
| Diode Type | PIN - Single |
| Case Connection | ISOLATED |
| Forward Current | 50mA |
| Application | ATTENUATOR |
| Forward Voltage | 1V |
| Capacitance @ Vr, F | 0.5pF @ 0V 100MHz |
| Reverse Voltage | 30V |
| Reverse Voltage (DC) | 30V |
| Frequency Band | ULTRA HIGH FREQUENCY |
| Resistance @ If, F | 50Ohm @ 1.5mA 100MHz |
| Diode Capacitance-Max | 0.5pF |
| Minority Carrier Lifetime-Nom | 4 μs |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
See Relate Datesheet
