Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Silver, Tin |
Mount | Surface Mount |
Package / Case | DO-213AC, MINI-MELF, SOD-80 |
Number of Pins | 2 |
Diode Element Material | SILICON |
Operating Temperature | 125°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2012 |
JESD-609 Code | e2 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Terminal Finish | Tin/Silver (Sn/Ag) |
HTS Code | 8541.10.00.80 |
Subcategory | PIN Diodes |
Technology | POSITIVE-INTRINSIC-NEGATIVE |
Terminal Position | END |
Terminal Form | WRAP AROUND |
Peak Reflow Temperature (Cel) | 250 |
Reach Compliance Code | unknown |
Time@Peak Reflow Temperature-Max (s) | 40 |
Pin Count | 2 |
Qualification Status | Not Qualified |
Number of Elements | 1 |
Max Current Rating | 50mA |
Element Configuration | Single |
Diode Type | PIN - Single |
Case Connection | ISOLATED |
Forward Current | 50mA |
Application | ATTENUATOR |
Forward Voltage | 1V |
Capacitance @ Vr, F | 0.5pF @ 0V 100MHz |
Reverse Voltage (DC) | 30V |
Frequency Band | ULTRA HIGH FREQUENCY |
Resistance @ If, F | 50Ohm @ 1.5mA 100MHz |
Diode Capacitance-Max | 0.5pF |
Minority Carrier Lifetime-Nom | 4 μs |
Diode Res Test Current | 1.5mA |
Diode Res Test Frequency | 100MHz |
RoHS Status | ROHS3 Compliant |