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BAP51-03,115

BAP51-03,115 datasheet pdf and Diodes - RF product details from NXP USA Inc. stock available at Feilidi


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-BAP51-03,115
  • Package: SC-76, SOD-323
  • Datasheet: PDF
  • Stock: 712
  • Description: BAP51-03,115 datasheet pdf and Diodes - RF product details from NXP USA Inc. stock available at Feilidi (Kg)

Details

Tags

Parameters
Number of Terminations 2
Terminal Finish Tin (Sn)
HTS Code 8541.10.00.70
Subcategory PIN Diodes
Technology POSITIVE-INTRINSIC-NEGATIVE
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number BAP51
Pin Count 2
JESD-30 Code R-PDSO-G2
Qualification Status Not Qualified
Number of Elements 1
Power Dissipation-Max 500mW
Diode Type PIN - Single
Current - Max 50mA
Capacitance @ Vr, F 0.35pF @ 5V 1MHz
Voltage - Peak Reverse (Max) 50V
Breakdown Voltage-Min 60V
Reverse Test Voltage 1V
Diode Capacitance-Nom 0.55pF
Resistance @ If, F 2.5Ohm @ 10mA 100MHz
Diode Capacitance-Max 0.55pF
Minority Carrier Lifetime-Nom 0.55 µs
Diode Res Test Current 0.5mA
Diode Res Test Frequency 100MHz
RoHS Status ROHS3 Compliant
Factory Lead Time 1 Week
Package / Case SC-76, SOD-323
Surface Mount YES
Diode Element Material SILICON
Operating Temperature -65°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2004
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
See Relate Datesheet

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