Parameters | |
---|---|
Factory Lead Time | 1 Week |
Package / Case | 2-XDFN |
Surface Mount | YES |
Diode Element Material | SILICON |
Operating Temperature | -65°C~150°C TJ |
Packaging | Tape & Reel (TR) |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
Terminal Finish | Tin (Sn) |
HTS Code | 8541.10.00.70 |
Subcategory | PIN Diodes |
Technology | POSITIVE-INTRINSIC-NEGATIVE |
Terminal Position | DUAL |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Base Part Number | BAP55 |
Pin Count | 2 |
JESD-30 Code | R-PDSO-N2 |
Qualification Status | Not Qualified |
Number of Elements | 1 |
Power Dissipation-Max | 135mW |
Diode Type | PIN - Single |
Application | ATTENUATOR; SWITCHING |
Current - Max | 100mA |
Capacitance @ Vr, F | 0.28pF @ 20V 1MHz |
Voltage - Peak Reverse (Max) | 50V |
Breakdown Voltage-Min | 50V |
Reverse Test Voltage | 20V |
Frequency Band | S B |
Diode Capacitance-Nom | 0.28pF |
Resistance @ If, F | 800mOhm @ 100mA 100MHz |
Diode Capacitance-Max | 0.28pF |
Minority Carrier Lifetime-Nom | 0.27 µs |
Diode Res Test Current | 0.5mA |
Diode Res Test Frequency | 100MHz |
Diode Forward Resistance-Max | 4.5Ohm |
RoHS Status | ROHS3 Compliant |