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BAP55LX,315

BAP55LX,315 datasheet pdf and Diodes - RF product details from NXP USA Inc. stock available at Feilidi


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-BAP55LX,315
  • Package: 2-XDFN
  • Datasheet: PDF
  • Stock: 923
  • Description: BAP55LX,315 datasheet pdf and Diodes - RF product details from NXP USA Inc. stock available at Feilidi (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Package / Case 2-XDFN
Surface Mount YES
Diode Element Material SILICON
Operating Temperature -65°C~150°C TJ
Packaging Tape & Reel (TR)
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Terminal Finish Tin (Sn)
HTS Code 8541.10.00.70
Subcategory PIN Diodes
Technology POSITIVE-INTRINSIC-NEGATIVE
Terminal Position DUAL
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number BAP55
Pin Count 2
JESD-30 Code R-PDSO-N2
Qualification Status Not Qualified
Number of Elements 1
Power Dissipation-Max 135mW
Diode Type PIN - Single
Application ATTENUATOR; SWITCHING
Current - Max 100mA
Capacitance @ Vr, F 0.28pF @ 20V 1MHz
Voltage - Peak Reverse (Max) 50V
Breakdown Voltage-Min 50V
Reverse Test Voltage 20V
Frequency Band S B
Diode Capacitance-Nom 0.28pF
Resistance @ If, F 800mOhm @ 100mA 100MHz
Diode Capacitance-Max 0.28pF
Minority Carrier Lifetime-Nom 0.27 µs
Diode Res Test Current 0.5mA
Diode Res Test Frequency 100MHz
Diode Forward Resistance-Max 4.5Ohm
RoHS Status ROHS3 Compliant
See Relate Datesheet

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