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BAP64-04,215

BAP64-04,215 datasheet pdf and Diodes - RF product details from NXP USA Inc. stock available at Feilidi


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-BAP64-04,215
  • Package: TO-236-3, SC-59, SOT-23-3
  • Datasheet: PDF
  • Stock: 366
  • Description: BAP64-04,215 datasheet pdf and Diodes - RF product details from NXP USA Inc. stock available at Feilidi (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Package / Case TO-236-3, SC-59, SOT-23-3
Surface Mount YES
Diode Element Material SILICON
Operating Temperature -65°C~150°C TJ
Packaging Tape & Reel (TR)
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3
Terminal Finish Tin (Sn)
Additional Feature HIGH VOLTAGE
HTS Code 8541.10.00.70
Subcategory PIN Diodes
Technology POSITIVE-INTRINSIC-NEGATIVE
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number BAP64-04
Pin Count 3
JESD-30 Code R-PDSO-G3
Qualification Status Not Qualified
Number of Elements 2
Configuration SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
Power Dissipation-Max 250mW
Diode Type PIN - 1 Pair Series Connection
Application ATTENUATOR; SWITCHING
Current - Max 100mA
Capacitance @ Vr, F 0.35pF @ 20V 1MHz
Voltage - Peak Reverse (Max) 175V
Breakdown Voltage-Min 175V
Frequency Band S B
Diode Capacitance-Nom 0.52pF
Resistance @ If, F 1.35Ohm @ 100mA 100MHz
Diode Capacitance-Max 0.35pF
Minority Carrier Lifetime-Nom 1.55 µs
Diode Res Test Current 0.5mA
Diode Res Test Frequency 100MHz
Diode Forward Resistance-Max 40Ohm
RoHS Status ROHS3 Compliant
See Relate Datesheet

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