Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 3-XDFN Exposed Pad |
Diode Element Material | SILICON |
Packaging | Tape & Reel (TR) |
Series | Automotive, AEC-Q101 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
Terminal Position | DUAL |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Pin Count | 3 |
Reference Standard | AEC-Q101; IEC-60134 |
JESD-30 Code | R-PDSO-N3 |
Operating Temperature (Max) | 150°C |
Number of Elements | 1 |
Configuration | SINGLE |
Power Dissipation-Max | 0.305W |
Speed | Standard Recovery >500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 5nA @ 75V |
Voltage - Forward (Vf) (Max) @ If | 1.25V @ 150mA |
Case Connection | CATHODE |
Operating Temperature - Junction | -55°C~150°C |
Output Current-Max | 0.3A |
Current - Average Rectified (Io) | 300mA DC |
Max Reverse Voltage (DC) | 75V |
Average Rectified Current | 300mA |
Reverse Recovery Time | 3 μs |
Capacitance @ Vr, F | 2pF @ 0V 1MHz |
RoHS Status | ROHS3 Compliant |