Parameters | |
---|---|
Package / Case | DO-213AC, MINI-MELF, SOD-80 |
Surface Mount | YES |
Number of Pins | 2 |
Diode Element Material | SILICON |
Packaging | Tape & Reel (TR) |
Published | 2010 |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Terminal Finish | Tin (Sn) |
HTS Code | 8541.10.00.70 |
Terminal Position | END |
Terminal Form | WRAP AROUND |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Base Part Number | BAS32 |
Pin Count | 2 |
Reference Standard | IEC-60134 |
Number of Elements | 1 |
Configuration | SINGLE |
Power Dissipation-Max | 0.5W |
Speed | Small Signal =< 200mA (Io), Any Speed |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 5μA @ 75V |
Voltage - Forward (Vf) (Max) @ If | 1V @ 100mA |
Case Connection | ISOLATED |
Forward Current | 200mA |
Operating Temperature - Junction | 200°C Max |
Voltage - DC Reverse (Vr) (Max) | 75V |
Current - Average Rectified (Io) | 200mA DC |
Forward Voltage | 1V |
Reverse Recovery Time | 4ns |
Rep Pk Reverse Voltage-Max | 100V |
Capacitance @ Vr, F | 2pF @ 0V 1MHz |
RoHS Status | ROHS3 Compliant |
Factory Lead Time | 1 Week |
Mounting Type | Surface Mount |