Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 6-TSSOP, SC-88, SOT-363 |
Number of Pins | 6 |
Weight | 6.010099mg |
Diode Element Material | SILICON |
Packaging | Tape & Reel (TR) |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 6 |
Termination | SMD/SMT |
ECCN Code | EAR99 |
Max Operating Temperature | 125°C |
Min Operating Temperature | -55°C |
Additional Feature | HIGH RELIABILITY |
HTS Code | 8541.10.00.70 |
Capacitance | 5pF |
Subcategory | Other Diodes |
Power Rating | 200mW |
Max Power Dissipation | 200mW |
Terminal Position | DUAL |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 40 |
Base Part Number | BAS40BRW |
Pin Count | 6 |
Number of Elements | 4 |
Speed | Small Signal =< 200mA (Io), Any Speed |
Diode Type | Schottky |
Current - Reverse Leakage @ Vr | 200nA @ 30V |
Power Dissipation | 200mW |
Voltage - Forward (Vf) (Max) @ If | 1V @ 40mA |
Forward Current | 40mA |
Operating Temperature - Junction | -55°C~125°C |
Output Current-Max | 0.2A |
Current - Average Rectified (Io) | 200mA DC |
Forward Voltage | 1V |
Max Reverse Voltage (DC) | 40V |
Average Rectified Current | 200mA |
Reverse Recovery Time | 5 ns |
Peak Reverse Current | 200nA |
Max Repetitive Reverse Voltage (Vrrm) | 40V |
Peak Non-Repetitive Surge Current | 600mA |
Diode Configuration | 2 Pair Series Connection |
Max Forward Surge Current (Ifsm) | 600mA |
Reverse Test Voltage | 30V |
Height | 1mm |
Length | 2.2mm |
Width | 1.35mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |