Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | SOD-882 |
Number of Pins | 2 |
Diode Element Material | SILICON |
Packaging | Tape & Reel (TR) |
Published | 2002 |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Max Operating Temperature | 150°C |
Min Operating Temperature | -65°C |
HTS Code | 8541.10.00.70 |
Terminal Position | BOTTOM |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 40 |
Base Part Number | BAS40L |
Pin Count | 2 |
Qualification Status | Not Qualified |
Number of Elements | 1 |
Element Configuration | Single |
Speed | Small Signal =< 200mA (Io), Any Speed |
Diode Type | Schottky |
Current - Reverse Leakage @ Vr | 10μA @ 40V |
Voltage - Forward (Vf) (Max) @ If | 1V @ 40mA |
Forward Current | 120mA |
Max Reverse Leakage Current | 10μA |
Operating Temperature - Junction | 150°C Max |
Max Surge Current | 200mA |
Current - Average Rectified (Io) | 120mA DC |
Forward Voltage | 1V |
Max Reverse Voltage (DC) | 40V |
Average Rectified Current | 120mA |
Peak Reverse Current | 10μA |
Max Repetitive Reverse Voltage (Vrrm) | 40V |
Capacitance @ Vr, F | 5pF @ 0V 1MHz |
Peak Non-Repetitive Surge Current | 200mA |
Max Forward Surge Current (Ifsm) | 200mA |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |