BAS85-GS18
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Silver, Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | DO-213AC, MINI-MELF, SOD-80 |
| Number of Pins | 2 |
| Diode Element Material | SILICON |
| Packaging | Tape & Reel (TR) |
| Series | Automotive, AEC-Q101 |
| JESD-609 Code | e2 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver (Sn/Ag) |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| HTS Code | 8541.10.00.70 |
| Capacitance | 10pF |
| Subcategory | Rectifier Diodes |
| Terminal Position | END |
| Terminal Form | WRAP AROUND |
| Peak Reflow Temperature (Cel) | 250 |
| Current Rating | 200mA |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Base Part Number | BAS85 |
| Pin Count | 2 |
| Number of Elements | 1 |
| Element Configuration | Single |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) |
| Diode Type | Schottky |
| Current - Reverse Leakage @ Vr | 2μA @ 25V |
| Voltage - Forward (Vf) (Max) @ If | 800mV @ 100mA |
| Case Connection | ISOLATED |
| Forward Current | 200mA |
| Max Reverse Leakage Current | 2μA |
| Operating Temperature - Junction | 125°C Max |
| Max Surge Current | 600mA |
| Forward Voltage | 800mV |
| Max Reverse Voltage (DC) | 30V |
| Average Rectified Current | 200mA |
| Reverse Recovery Time | 5 ns |
| Max Repetitive Reverse Voltage (Vrrm) | 30V |
| Capacitance @ Vr, F | 10pF @ 1V 1MHz |
| Peak Non-Repetitive Surge Current | 600mA |
| Recovery Time | 5 ns |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet
