Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Silver, Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | DO-213AC, MINI-MELF, SOD-80 |
Number of Pins | 2 |
Diode Element Material | SILICON |
Packaging | Tape & Reel (TR) |
Published | 2008 |
Series | Automotive, AEC-Q101 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
Termination | SMD/SMT |
Max Operating Temperature | 175°C |
Min Operating Temperature | -65°C |
Capacitance | 1.5pF |
Terminal Position | END |
Terminal Form | WRAP AROUND |
Base Part Number | BAV103 |
Pin Count | 2 |
Number of Elements | 1 |
Voltage | 250V |
Element Configuration | Single |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Current | 1A |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 100nA @ 200V |
Power Dissipation | 500mW |
Voltage - Forward (Vf) (Max) @ If | 1V @ 100mA |
Case Connection | ISOLATED |
Forward Current | 250mA |
Max Reverse Leakage Current | 100nA |
Operating Temperature - Junction | 175°C Max |
Max Surge Current | 1A |
Current - Average Rectified (Io) | 250mA DC |
Forward Voltage | 1V |
Max Reverse Voltage (DC) | 200V |
Average Rectified Current | 250mA |
Reverse Recovery Time | 50 ns |
Peak Reverse Current | 15μA |
Max Repetitive Reverse Voltage (Vrrm) | 250V |
Capacitance @ Vr, F | 1.5pF @ 0V 1MHz |
Peak Non-Repetitive Surge Current | 1A |
Reverse Voltage | 200V |
Max Forward Surge Current (Ifsm) | 1A |
Recovery Time | 50 ns |
Max Junction Temperature (Tj) | 175°C |
Diameter | 1.6mm |
Height | 1.6mm |
Length | 3.683mm |
Width | 1.6mm |
Radiation Hardening | No |
REACH SVHC | Unknown |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |