Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | DO-213AC, MINI-MELF, SOD-80 |
Number of Pins | 2 |
Diode Element Material | SILICON |
Packaging | Tape & Reel (TR) |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Max Operating Temperature | 175°C |
Min Operating Temperature | -65°C |
HTS Code | 8541.10.00.80 |
Terminal Position | END |
Terminal Form | WRAP AROUND |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Base Part Number | BAV103 |
Pin Count | 2 |
Reference Standard | IEC-60134 |
Number of Elements | 1 |
Power Dissipation-Max | 0.4W |
Element Configuration | Single |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 100nA @ 200V |
Voltage - Forward (Vf) (Max) @ If | 1.25V @ 200mA |
Case Connection | ISOLATED |
Forward Current | 250mA |
Max Reverse Leakage Current | 100nA |
Operating Temperature - Junction | 175°C Max |
Max Surge Current | 9A |
Current - Average Rectified (Io) | 250mA DC |
Forward Voltage | 1.25V |
Max Reverse Voltage (DC) | 200V |
Average Rectified Current | 250mA |
Reverse Recovery Time | 50 ns |
Max Repetitive Reverse Voltage (Vrrm) | 250V |
Capacitance @ Vr, F | 5pF @ 0V 1MHz |
Peak Non-Repetitive Surge Current | 9A |
Recovery Time | 50 ns |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |