Parameters | |
---|---|
Power Dissipation-Max | 0.35W |
Element Configuration | Common Cathode |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 500nA @ 80V |
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Voltage - Forward (Vf) (Max) @ If | 1.25V @ 150mA |
Mount | Surface Mount |
Forward Current | 250mA |
Mounting Type | Surface Mount |
Max Reverse Leakage Current | 500nA |
Package / Case | 6-TSSOP, SC-88, SOT-363 |
Operating Temperature - Junction | 150°C Max |
Number of Pins | 6 |
Max Surge Current | 4A |
Diode Element Material | SILICON |
Output Current-Max | 0.25A |
Packaging | Tape & Reel (TR) |
Current - Average Rectified (Io) | 250mA DC |
Published | 2007 |
Forward Voltage | 1.25V |
JESD-609 Code | e3 |
Max Reverse Voltage (DC) | 100V |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Average Rectified Current | 250mA |
Number of Terminations | 6 |
Reverse Recovery Time | 4 ns |
ECCN Code | EAR99 |
Peak Reverse Current | 500nA |
Max Operating Temperature | 150°C |
Max Repetitive Reverse Voltage (Vrrm) | 100V |
Min Operating Temperature | -65°C |
Peak Non-Repetitive Surge Current | 4A |
HTS Code | 8541.10.00.70 |
Reverse Voltage | 100V |
Capacitance | 1.5pF |
Diode Configuration | 2 Pair Common Cathode |
Max Forward Surge Current (Ifsm) | 500mA |
Terminal Position | DUAL |
Recovery Time | 4 ns |
Terminal Form | GULL WING |
Max Junction Temperature (Tj) | 150°C |
Ambient Temperature Range High | 150°C |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Height | 1.1mm |
Base Part Number | BAV70S |
Radiation Hardening | No |
Pin Count | 6 |
RoHS Status | ROHS3 Compliant |
Number of Elements | 4 |