Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 33-SMD Module |
Operating Temperature | -40°C~125°C |
Packaging | Tray |
Published | 2013 |
Series | VI Chip® BCM® (300W) |
Size / Dimension | 1.28Lx0.87W x 0.26 H 32.5mmx22.0mmx6.7mm |
Feature | OCP, OTP, OVP, SCP, UVLO |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
ECCN Code | EAR99 |
Type | Bus Converter Module |
Applications | ITE (Commercial) |
Power (Watts) | 300W |
Max Power Dissipation | 300W |
Number of Outputs | 1 |
Efficiency | 95.5% |
Voltage - Isolation | 4.242kV |
Voltage - Input (Max) | 365V |
Max Output Current | 28.5A |
Voltage - Output 1 | 11V |
Voltage - Input (Min) | 330V |
Height | 6.604mm |
RoHS Status | ROHS3 Compliant |