Parameters | |
---|---|
Number of Terminations | 30 |
Type | Bus Converter Module |
Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
Applications | ITE (Commercial) |
Power (Watts) | 325W |
Max Power Dissipation | 326W |
Terminal Position | DUAL |
Terminal Form | UNSPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Number of Functions | 1 |
Supply Voltage | 350V |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Pin Count | 30 |
JESD-30 Code | R-XDMA-X |
Number of Outputs | 1 |
Qualification Status | Not Qualified |
Efficiency | 95.7% |
Voltage - Isolation | 4.242kV |
Voltage - Input (Max) | 365V |
Max Output Current | 7.4A |
Voltage - Output 1 | 44V |
Voltage - Input (Min) | 330V |
Supply Voltage-Max (Vsup) | 365V |
Supply Voltage-Min (Vsup) | 330V |
Height | 6.604mm |
Length | 32.5mm |
Width | 22mm |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | Module |
Operating Temperature | -40°C~125°C |
Packaging | Tray |
Published | 2010 |
Series | VI Chip® BCM® (325W) |
Size / Dimension | 1.28Lx0.87W x 0.26 H 32.5mmx22.0mmx6.7mm |
JESD-609 Code | e4 |
Feature | Remote On/Off, UVLO |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |