Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | 24-DIP Module |
Operating Temperature | -40°C~125°C |
Packaging | Tray |
Published | 2017 |
Series | VI Chip® BCM® (800W) |
Size / Dimension | 2.40Lx0.99W x 0.29 H 61.0mmx25.1mmx7.3mm |
Feature | OCP, OTP, OVP, SCP, UVLO |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
ECCN Code | EAR99 |
Type | Bus Converter Module |
Applications | ITE (Commercial) |
Power (Watts) | 800W |
Max Power Dissipation | 800W |
Number of Outputs | 1 |
Efficiency | 97.2% |
Voltage - Isolation | 4.242kV |
Voltage - Input (Max) | 410V |
Max Output Current | 68A |
Voltage - Output 1 | 12V |
Voltage - Input (Min) | 260V |
Height | 7.366mm |
RoHS Status | ROHS3 Compliant |