BCM48BF040T200B00
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | Module |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2010 |
| Series | VI Chip® BCM® (200W) |
| Size / Dimension | 1.28Lx0.87W x 0.26 H 32.5mmx22.0mmx6.7mm |
| Feature | Remote On/Off, OCP, OTP, OVP, SCP, UVLO |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 60 |
| ECCN Code | EAR99 |
| Type | Bus Converter Module |
| Applications | ITE (Commercial) |
| Power (Watts) | 200W |
| Max Power Dissipation | 200W |
| Technology | HYBRID |
| Terminal Position | DUAL |
| Terminal Form | J BEND |
| Number of Functions | 1 |
| JESD-30 Code | R-XDMA-J60 |
| Number of Outputs | 1 |
| Efficiency | 94.1% |
| Voltage - Isolation | 2.25kV |
| Voltage - Input (Max) | 55V |
| Output Voltage | 4V |
| Max Output Current | 53A |
| Voltage - Output 1 | 4V |
| Voltage - Input (Min) | 38V |
| Input Voltage-Nom | 48V |
| Trim/Adjustable Output | NO |
| Total Power Output-Max | 300W |
| Height | 6.604mm |
| Length | 32.5mm |
| Width | 22mm |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet
