Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 30-SMD Module |
Operating Temperature | -40°C~125°C |
Packaging | Tray |
Published | 2013 |
Series | VI Chip® BCM® (240W) |
Size / Dimension | 1.28Lx0.87W x 0.26 H 32.5mmx22.0mmx6.7mm |
Feature | Remote On/Off, OCP, OTP, OVP, SCP, UVLO |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Number of Terminations | 60 |
ECCN Code | EAR99 |
Type | Bus Converter Module |
Applications | ITE (Commercial) |
Power (Watts) | 240W |
Max Power Dissipation | 240W |
Technology | HYBRID |
Terminal Position | QUAD |
Terminal Form | J BEND |
Number of Functions | 1 |
JESD-30 Code | R-XQMA-J60 |
Number of Outputs | 1 |
Efficiency | 95.6% |
Voltage - Isolation | 2.25kV |
Voltage - Input (Max) | 55V |
Output Voltage | 6V |
Max Output Current | 60A |
Voltage - Output 1 | 6V |
Voltage - Input (Min) | 38V |
Input Voltage-Nom | 48V |
Trim/Adjustable Output | NO |
Height | 6.604mm |
Length | 32.5mm |
Width | 22mm |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |