Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | Module |
Operating Temperature | -40°C~125°C |
Packaging | Tray |
Published | 2015 |
Series | VI Chip® BCM® (300W) |
Size / Dimension | 1.28Lx0.87W x 0.26 H 32.5mmx22.0mmx6.7mm |
JESD-609 Code | e4 |
Feature | OCP, OTP, SCP, UVLO |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Number of Terminations | 60 |
ECCN Code | EAR99 |
Type | Bus Converter Module |
Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
Applications | ITE (Commercial) |
Power (Watts) | 300W |
Max Power Dissipation | 288W |
Technology | HYBRID |
Terminal Position | QUAD |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Number of Functions | 1 |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-XQMA-T60 |
Number of Outputs | 1 |
Efficiency | 94% |
Voltage - Isolation | 2.25kV |
Voltage - Input (Max) | 55V |
Output Voltage | 24V |
Max Output Current | 12A |
Voltage - Output 1 | 24V |
Voltage - Input (Min) | 38V |
Input Voltage-Nom | 48V |
Trim/Adjustable Output | NO |
Total Power Output-Max | 300W |
Height | 6.858mm |
Length | 32.5mm |
Width | 22mm |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |