Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | 24-DIP Module |
Operating Temperature | -40°C~125°C |
Packaging | Tray |
Series | VI Chip® BCM® |
Size / Dimension | 2.40Lx0.99W x 0.29 H 61.0mmx25.1mmx7.3mm |
Feature | OCP, OTP, OVP, SCP, UVLO |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 24 |
ECCN Code | EAR99 |
Type | Bus Converter Module |
Applications | ITE (Commercial) |
Power (Watts) | 1500W |
Max Power Dissipation | 1.35kW |
Technology | HYBRID |
Terminal Position | DUAL |
Number of Functions | 1 |
JESD-30 Code | R-XDMA-T24 |
Number of Outputs | 1 |
Approval Agency | CE, TUV, UL, CURUS,EN |
Efficiency | 97.6% |
Voltage - Isolation | 2.25kV |
Voltage - Input (Max) | 60V |
Output Voltage | 9V |
Max Output Current | 150A |
Voltage - Output 1 | 9V |
Voltage - Input (Min) | 36V |
Input Voltage-Nom | 54V |
Trim/Adjustable Output | NO |
Protections | OUTPUT CURRENT, THERMAL |
Control Mode | VOLTAGE-MODE |
Switching Frequency-Max | 950kHz |
Height | 7.366mm |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |