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BDN09-3CB

HEATSINK CPU .91" SQ


  • Manufacturer: CTS Thermal Management Products
  • Nocochips NO: 221-BDN09-3CB
  • Package: -
  • Datasheet: -
  • Stock: 590
  • Description: HEATSINK CPU .91" SQ (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Material Aluminum
Shape Square, Pin Fins
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Material Finish Black Anodized
Published 2017
Series BDN
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Top Mount
Construction EXTRUDED
Attachment Method Thermal Tape, Adhesive (Not Included)
Height Off Base (Height of Fin) 0.355 9.02mm
Thermal Resistance @ Forced Air Flow 9.60°C/W @ 400 LFM
Thermal Resistance @ Natural 26.90°C/W
Profile PIN FIN ARRAY
Fin Orientation OMNIDIRECT
Device Used On IC
Length 0.910 23.11mm
Width 0.910 23.11mm
RoHS Status RoHS Compliant
See Relate Datesheet

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