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BDN18-6CB/A01

HEATSINK CPU W/ADHESIVE 1.81"SQ


  • Manufacturer: CTS Thermal Management Products
  • Nocochips NO: 221-BDN18-6CB/A01
  • Package: -
  • Datasheet: PDF
  • Stock: 570
  • Description: HEATSINK CPU W/ADHESIVE 1.81"SQ (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Material Aluminum
Shape Square, Pin Fins
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Material Finish Black Anodized
Published 2007
Series BDN
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Top Mount
Construction EXTRUDED
Attachment Method Thermal Tape, Adhesive (Included)
Height Off Base (Height of Fin) 0.605 15.37mm
Thermal Resistance @ Forced Air Flow 2.80°C/W @ 400 LFM
Thermal Resistance @ Natural 8.10°C/W
Profile PIN FIN ARRAY
Fin Orientation OMNIDIRECT
Device Used On IC
Length 1.810 45.97mm
Width 1.810 45.97mm
RoHS Status RoHS Compliant
See Relate Datesheet

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