BF556C,215
| Parameters | |
|---|---|
| Package / Case | TO-236-3, SC-59, SOT-23-3 |
| Surface Mount | YES |
| Transistor Element Material | SILICON |
| Packaging | Tape & Reel (TR) |
| Published | 2013 |
| JESD-609 Code | e3 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 3 |
| Terminal Finish | Tin (Sn) |
| Voltage - Rated | 30V |
| HTS Code | 8541.21.00.75 |
| Subcategory | Other Transistors |
| Current Rating (Amps) | 18mA |
| Terminal Position | DUAL |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 260 |
| Reach Compliance Code | unknown |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Base Part Number | BF556 |
| Pin Count | 3 |
| JESD-30 Code | R-PDSO-G3 |
| Qualification Status | Not Qualified |
| Operating Temperature (Max) | 150°C |
| Number of Elements | 1 |
| Configuration | SINGLE |
| Operating Mode | DEPLETION MODE |
| Transistor Application | AMPLIFIER |
| Transistor Type | N-Channel JFET |
| JEDEC-95 Code | TO-236AB |
| DS Breakdown Voltage-Min | 30V |
| FET Technology | JUNCTION |
| Power Dissipation-Max (Abs) | 0.25W |
| Highest Frequency Band | VERY HIGH FREQUENCY B |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet
