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BGB741L7ESDE6327XTSA1

BGB741L7ESDE6327XTSA1 datasheet pdf and RF Amplifiers product details from Infineon Technologies stock available at Feilidi


  • Manufacturer: Infineon Technologies
  • Nocochips NO: 376-BGB741L7ESDE6327XTSA1
  • Package: 6-XFDFN Exposed Pad
  • Datasheet: PDF
  • Stock: 538
  • Description: BGB741L7ESDE6327XTSA1 datasheet pdf and RF Amplifiers product details from Infineon Technologies stock available at Feilidi (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 6-XFDFN Exposed Pad
Number of Pins 6
Packaging Tape & Reel (TR)
Published 2009
JESD-609 Code e4
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Terminal Finish Gold (Au)
Max Operating Temperature 150°C
Min Operating Temperature -55°C
Max Power Dissipation 120mW
Voltage - Supply 1.8V~4V
Construction COMPONENT
Frequency 50MHz~3.5GHz
Test Frequency 1.5GHz
Current - Supply 30mA
Halogen Free Halogen Free
Gain 19.5dB
RF/Microwave Device Type WIDE BAND LOW POWER
RF Type Cellular, RKE, WiFi
Input Power-Max (CW) 20dBm
Characteristic Impedance 50Ohm
Max Junction Temperature (Tj) 150°C
Noise Figure 1dB
P1dB -6.5dBm
Height 500μm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
See Relate Datesheet

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