Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mounting Type | Surface Mount |
Package / Case | 6-XFDFN |
Surface Mount | YES |
Packaging | Tape & Reel (TR) |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 6 |
Terminal Finish | NOT SPECIFIED |
Technology | CMOS |
Terminal Position | BOTTOM |
Terminal Form | BUTT |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Number of Functions | 1 |
Frequency | 600MHz~2.7GHz |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-XBCC-B6 |
Telecom IC Type | RF AND BASEBAND CIRCUIT |
RF Type | Cellular, CDMA, GSM, HSPA+, LTE, TD-SCDMA, W-CDMA |
RoHS Status | ROHS3 Compliant |