banner_page

BGM1032N7E6327XUSA1

BGM1032N7E6327XUSA1 datasheet pdf and RF Misc ICs and Modules product details from Infineon Technologies stock available at Feilidi


  • Manufacturer: Infineon Technologies
  • Nocochips NO: 376-BGM1032N7E6327XUSA1
  • Package: 6-WDFN Exposed Pad
  • Datasheet: -
  • Stock: 154
  • Description: BGM1032N7E6327XUSA1 datasheet pdf and RF Misc ICs and Modules product details from Infineon Technologies stock available at Feilidi (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Contact Plating Silver, Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 6-WDFN Exposed Pad
Number of Pins 7
Packaging Tape & Reel (TR)
Published 2011
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 6
Max Operating Temperature 85°C
Min Operating Temperature -40°C
HTS Code 8542.39.00.01
Max Power Dissipation 90mW
Terminal Position DUAL
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 2.7V
Terminal Pitch 0.54mm
Frequency 1575.42MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PDSO-N6
Function GPS Front End
Temperature Grade INDUSTRIAL
Max Supply Voltage 3.6V
Halogen Free Halogen Free
Gain 14.8 dB
Telecom IC Type TELECOM CIRCUIT
RF Type GPS
Length 2.3mm
RoHS Status RoHS Compliant
Lead Free Lead Free
See Relate Datesheet

Write a review

Note: HTML is not translated!
    Bad           Good