BGM15LA12E6327XTSA1
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 12-UFQFN Exposed Pad |
| Surface Mount | YES |
| Packaging | Tape & Reel (TR) |
| Published | 2015 |
| JESD-609 Code | e4 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 12 |
| Terminal Finish | Gold/Nickel (Au/Ni) |
| HTS Code | 8542.39.00.01 |
| Voltage - Supply | 2.2V~3.3V |
| Terminal Position | BOTTOM |
| Terminal Form | BUTT |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Functions | 1 |
| Supply Voltage | 2.8V |
| Terminal Pitch | 0.4mm |
| Frequency | 700MHz~1GHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-XBCC-B12 |
| Operating Temperature (Max) | 85°C |
| Operating Temperature (Min) | -40°C |
| Temperature Grade | INDUSTRIAL |
| Test Frequency | 925MHz~960MHz |
| Current - Supply | 4.9mA |
| Halogen Free | Halogen Free |
| Gain | 17.3dB |
| Telecom IC Type | TELECOM CIRCUIT |
| RF Type | LTE, W-CDMA |
| Noise Figure | 1.1dB |
| P1dB | -8dBm |
| Height Seated (Max) | 0.65mm |
| Length | 1.9mm |
| Width | 1.1mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
See Relate Datesheet
