BGM781N11E6327
| Parameters | |
|---|---|
| Contact Plating | Tin |
| Mount | Surface Mount |
| Package / Case | Module |
| Number of Pins | 10 |
| Number of Terminations | 11 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| HTS Code | 8542.39.00.01 |
| Terminal Position | DUAL |
| Terminal Form | NO LEAD |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Functions | 1 |
| Supply Voltage | 1.8V |
| Frequency | 1.57542GHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PDSO-N11 |
| Operating Supply Voltage | 1.8V |
| Temperature Grade | INDUSTRIAL |
| Power Dissipation-Max | 90mW |
| Nominal Supply Current | 25mA |
| Telecom IC Type | TELECOM CIRCUIT |
| Noise Figure | 1.7 dB |
| Height Seated (Max) | 0.77mm |
| Length | 2.5mm |
| Width | 2.5mm |
| RoHS Status | RoHS Compliant |
See Relate Datesheet
