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BOND PLY 660P 11X12

THERM PAD 304.8MMX279.4MM W/ADH


  • Manufacturer: Bergquist
  • Nocochips NO: 108-BOND PLY 660P 11X12"
  • Package: -
  • Datasheet: PDF
  • Stock: 212
  • Description: THERM PAD 304.8MMX279.4MM W/ADH (Kg)

Details

Tags

Parameters
Material Polyimide
Shape Rectangular
Published 2009
Series Bond-Ply® 660P
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Sheet, Tape
Color Brown
Adhesive Adhesive - Both Sides
Backing, Carrier Polyimide
Outline 304.80mm x 279.40mm
Thermal Conductivity 0.4W/m-K
Thermal Resistivity 0.81°C/W
Thickness 0.0080 0.203mm
See Relate Datesheet

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