Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mounting Type | Surface Mount |
Package / Case | TO-236-3, SC-59, SOT-23-3 |
Surface Mount | YES |
Number of Pins | 3 |
Weight | 4.535924g |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 1998 |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
Termination | SMD/SMT |
ECCN Code | EAR99 |
Resistance | 900mOhm |
Additional Feature | LOGIC LEVEL COMPATIBLE |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Pin Count | 3 |
Number of Elements | 1 |
Power Dissipation-Max | 417mW Ta |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 417mW |
Turn On Delay Time | 2 ns |
FET Type | P-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 900m Ω @ 280mA, 10V |
Vgs(th) (Max) @ Id | 1.9V @ 1mA |
Input Capacitance (Ciss) (Max) @ Vds | 80pF @ 24V |
Current - Continuous Drain (Id) @ 25°C | 520mA Ta |
Gate Charge (Qg) (Max) @ Vgs | 2.9nC @ 10V |
Rise Time | 4.5ns |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 4.5 ns |
Turn-Off Delay Time | 45 ns |
Continuous Drain Current (ID) | -520mA |
Threshold Voltage | -1.9V |
Gate to Source Voltage (Vgs) | 20V |
Max Dual Supply Voltage | -30V |
Drain Current-Max (Abs) (ID) | 0.52A |
Drain to Source Breakdown Voltage | 30V |
Dual Supply Voltage | -30V |
Nominal Vgs | -1.9 V |
Height | 6.35mm |
Length | 6.35mm |
Width | 6.35mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |