Parameters | |
---|---|
Lead Free | Lead Free |
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | TO-261-4, TO-261AA |
Number of Pins | 4 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2002 |
Series | SIPMOS® |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 4 |
ECCN Code | EAR99 |
Additional Feature | LOGIC LEVEL COMPATIBLE |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Pin Count | 4 |
Number of Elements | 1 |
Power Dissipation-Max | 1.8W Ta |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 1.8W |
Case Connection | DRAIN |
Turn On Delay Time | 5 ns |
FET Type | P-Channel |
Rds On (Max) @ Id, Vgs | 12 Ω @ 260mA, 10V |
Vgs(th) (Max) @ Id | 2V @ 130μA |
Halogen Free | Halogen Free |
Input Capacitance (Ciss) (Max) @ Vds | 104pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 260mA Ta |
Gate Charge (Qg) (Max) @ Vgs | 5.4nC @ 10V |
Rise Time | 6ns |
Drain to Source Voltage (Vdss) | 250V |
Drive Voltage (Max Rds On,Min Rds On) | 2.8V 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 33 ns |
Turn-Off Delay Time | 67 ns |
Continuous Drain Current (ID) | 260mA |
Threshold Voltage | -1.5V |
Gate to Source Voltage (Vgs) | 20V |
Max Dual Supply Voltage | -250V |
Drain Current-Max (Abs) (ID) | 0.26A |
Drain to Source Breakdown Voltage | -250V |
Height | 1.5mm |
Length | 6.5mm |
Width | 3.5mm |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |