Parameters | |
---|---|
Drain to Source Breakdown Voltage | -50V |
Dual Supply Voltage | -50V |
FET Technology | METAL-OXIDE SEMICONDUCTOR |
FET Feature | Logic Level Gate |
Nominal Vgs | -1.6 V |
Min Breakdown Voltage | 50V |
Height | 1mm |
Length | 2.2mm |
Width | 1.35mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 6-TSSOP, SC-88, SOT-363 |
Number of Pins | 6 |
Weight | 6.010099mg |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2007 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 6 |
Termination | SMD/SMT |
ECCN Code | EAR99 |
Resistance | 10Ohm |
Subcategory | Other Transistors |
Voltage - Rated DC | -50V |
Max Power Dissipation | 300mW |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
Current Rating | -130mA |
Time@Peak Reflow Temperature-Max (s) | 40 |
Base Part Number | BSS84DW |
Pin Count | 6 |
Number of Elements | 2 |
Number of Channels | 2 |
Element Configuration | Dual |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 300mW |
Turn On Delay Time | 10 ns |
FET Type | 2 P-Channel (Dual) |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 10 Ω @ 100mA, 5V |
Vgs(th) (Max) @ Id | 2V @ 1mA |
Input Capacitance (Ciss) (Max) @ Vds | 45pF @ 25V |
Drain to Source Voltage (Vdss) | 50V |
Turn-Off Delay Time | 18 ns |
Continuous Drain Current (ID) | 130mA |
Threshold Voltage | -1.6V |
Gate to Source Voltage (Vgs) | 20V |
Drain Current-Max (Abs) (ID) | 0.13A |