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BU14OZ-178-HT

CONN IC DIP SOCKET 14POS GOLD


  • Manufacturer: On Shore Technology Inc.
  • Nocochips NO: 602-BU14OZ-178-HT
  • Package: -
  • Datasheet: PDF
  • Stock: 211
  • Description: CONN IC DIP SOCKET 14POS GOLD (Kg)

Details

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Parameters
Mating Contact Pitch 0.1 inch
Dielectric Withstanding Voltage 1400VAC V
PCB Contact Row Spacing 0.3 mm
Termination Post Length 0.059 1.50mm
Pitch - Post 0.100 2.54mm
Contact Finish Thickness - Mating 78.7μin 2.00μm
Contact Finish Thickness - Post Flash
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Factory Lead Time 1 Week
Mounting Type Surface Mount
Housing Material Polybutylene Terephthalate (PBT), Glass Filled
Number of Positions or Pins (Grid) 14 (2 x 7)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass
Operating Temperature -55°C~125°C
Packaging Tube
Series BU-178HT
Feature Open Frame
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Type DIP, 0.3 (7.62mm) Row Spacing
Contact Finish - Mating Gold
Current Rating (Amps) 1A
Terminal Pitch 2.54mm
Pitch - Mating 0.100 2.54mm
Body Length or Diameter 0.7 inch
Number of Contacts 14
Contact Finish - Post Copper
PCB Contact Pattern RECTANGULAR
Body Breadth 0.397 inch
Body Depth 0.169 inch
Contact Style RND PIN-SKT
Contact Resistance 7mOhm
Insulation Resistance 1000000000000Ohm
See Relate Datesheet

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