Parameters | |
---|---|
Breakdown Voltage-Min | 600V |
RoHS Status | ROHS3 Compliant |
Factory Lead Time | 1 Week |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | 4-SIP, BU |
Diode Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tray |
Published | 2017 |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 4 |
ECCN Code | EAR99 |
Terminal Finish | Matte Tin (Sn) |
Additional Feature | UL RECOGNIZED |
Technology | Standard |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Reach Compliance Code | unknown |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-PSFM-T4 |
Number of Elements | 4 |
Configuration | BRIDGE, 4 ELEMENTS |
Diode Type | Single Phase |
Current - Reverse Leakage @ Vr | 5μA @ 600V |
Voltage - Forward (Vf) (Max) @ If | 1.05V @ 7.5A |
Case Connection | ISOLATED |
Output Current-Max | 3.4A |
Current - Average Rectified (Io) | 15A |
Number of Phases | 1 |
Non-rep Pk Forward Current-Max | 200A |
Voltage - Peak Reverse (Max) | 600V |