BU9348K
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 44-QFP |
| Operating Temperature | -25°C~75°C |
| Packaging | Tray |
| Published | 2003 |
| Pbfree Code | yes |
| Part Status | Not For New Designs |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 44 |
| ECCN Code | EAR99 |
| HTS Code | 8542.39.00.01 |
| Subcategory | Other Consumer ICs |
| Voltage - Supply | 2.7V~3.6V |
| Terminal Position | QUAD |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.8mm |
| Base Part Number | BU9348 |
| Pin Count | 44 |
| JESD-30 Code | S-PQFP-G44 |
| Qualification Status | Not Qualified |
| Power Supplies | 3V |
| Supply Current-Max | 20mA |
| Consumer IC Type | CONSUMER CIRCUIT |
| Controller Type | Dynamic RAM (DRAM) |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
| Factory Lead Time | 1 Week |
BU9348K Overview
A package of materials from Tray is included with the product. It is provided in the 44-QFP to save board space. It is a type of Dynamic RAM (DRAM) with high quality and reliable performance. The operating temperature should be set at -25°C~75°C. It is necessary to supply voltage to 2.7V~3.6V in order to ensure normal operation. It is mounted based on the technique of Surface Mount. There are more related electronic parts based on the part number BU9348. To prevent signals from reflecting off the end of a transmission line, 44 terminations are used. There are two 44 pins on this device. There is a subcategory of Other Consumer ICs for this item. High efficiency can be achieved by using the power supplies of 3V. Surface Mount indicates the direction in which it is mounted on the PCB. It is recommended that the maximum supply current not exceed 20mA.
BU9348K Features
Available in the 44-QFP package
Dynamic RAM (DRAM) as controller type
Operating temperature of -25°C~75°C
BU9348K Applications
There are a lot of ROHM Semiconductor BU9348K Memory Controllers applications.
- Security Flash Drive
- Industrial USB Flash Drive
- Internet Appliances
- Disk-on-Board
- MultiMediaCardsTM (MMC)
- System-in-Package (SiP) embedded flash drives (eSSD)
- Embedded modules including U.2, M.2, MO-297 and MO-300
- Multi-Chip-Packages (MCP)
- Computers
- Embedded Systems
