Parameters | |
---|---|
Additional Feature | LOGIC LEVEL COMPATIBLE |
Technology | MOSFET (Metal Oxide) |
Terminal Position | SINGLE |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Pin Count | 4 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 85W Tc |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 85W |
Case Connection | DRAIN |
Turn On Delay Time | 16 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 28m Ω @ 15A, 10V |
Vgs(th) (Max) @ Id | 2V @ 1mA |
Input Capacitance (Ciss) (Max) @ Vds | 2070pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 34A Tc |
Gate Charge (Qg) (Max) @ Vgs | 19nC @ 5V |
Rise Time | 106ns |
Drive Voltage (Max Rds On,Min Rds On) | 5V |
Vgs (Max) | ±15V |
Fall Time (Typ) | 83 ns |
Turn-Off Delay Time | 51 ns |
Continuous Drain Current (ID) | 34A |
JEDEC-95 Code | MO-235 |
Gate to Source Voltage (Vgs) | 15V |
Max Dual Supply Voltage | 75V |
Drain-source On Resistance-Max | 0.03Ohm |
Drain to Source Breakdown Voltage | 75V |
Avalanche Energy Rating (Eas) | 78 mJ |
Height | 6.35mm |
Length | 6.35mm |
Width | 6.35mm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mounting Type | Surface Mount |
Package / Case | SC-100, SOT-669 |
Surface Mount | YES |
Number of Pins | 4 |
Weight | 4.535924g |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~175°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2008 |
Series | Automotive, AEC-Q101, TrenchMOS™ |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 4 |
ECCN Code | EAR99 |