BYV32EB-200,118
| Parameters | |
|---|---|
| JESD-30 Code | R-PSSO-G2 |
| Operating Temperature (Max) | 150°C |
| Number of Elements | 2 |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) |
| Diode Type | Standard |
| Current - Reverse Leakage @ Vr | 30μA @ 200V |
| Voltage - Forward (Vf) (Max) @ If | 1.15V @ 20A |
| Forward Current | 20A |
| Operating Temperature - Junction | 150°C Max |
| Application | ULTRA FAST SOFT RECOVERY |
| Voltage - DC Reverse (Vr) (Max) | 200V |
| Number of Phases | 1 |
| Reverse Recovery Time | 25ns |
| Rep Pk Reverse Voltage-Max | 200V |
| Diode Configuration | 1 Pair Common Cathode |
| Reverse Current-Max | 30μA |
| RoHS Status | RoHS Compliant |
| Mounting Type | Surface Mount |
| Package / Case | TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
| Surface Mount | YES |
| Diode Element Material | SILICON |
| Packaging | Tape & Reel (TR) |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin (Sn) |
| Terminal Position | SINGLE |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 260 |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Base Part Number | BYV32-200 |
| Reference Standard | IEC-60134 |
See Relate Datesheet
