Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | TO-236-3, SC-59, SOT-23-3 |
Diode Element Material | SILICON |
Packaging | Tape & Reel (TR) |
Published | 2009 |
Tolerance | ±5% |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Max Operating Temperature | 150°C |
Min Operating Temperature | -55°C |
HTS Code | 8541.10.00.50 |
Max Power Dissipation | 300mW |
Technology | ZENER |
Terminal Position | DUAL |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Pin Count | 3 |
Reference Standard | AEC-Q101; IEC-60134 |
JESD-30 Code | R-PDSO-G3 |
Number of Elements | 2 |
Polarity | UNIDIRECTIONAL |
Configuration | 1 Pair Common Anode |
Impedance | 200Ohm |
Element Configuration | Common Anode |
Diode Type | ZENER DIODE |
Current - Reverse Leakage @ Vr | 50nA @ 39.2V |
Voltage - Forward (Vf) (Max) @ If | 900mV @ 10mA |
Max Reverse Leakage Current | 50nA |
Impedance-Max | 200Ohm |
Test Current | 2mA |
Reference Voltage | 56V |
Zener Voltage | 56V |
Voltage Tol-Max | 5% |
JEDEC-95 Code | TO-236AB |
ESD Protection | No |
RoHS Status | ROHS3 Compliant |