Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | DO-214AC, SMA |
Number of Pins | 2 |
Diode Element Material | SILICON |
Operating Temperature | 150°C |
Packaging | Tape & Reel (TR) |
Published | 2013 |
JESD-609 Code | e3 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
HTS Code | 8541.10.00.50 |
Max Power Dissipation | 1.25W |
Terminal Position | DUAL |
Terminal Form | C BEND |
Peak Reflow Temperature (Cel) | 260 |
Base Part Number | BZG03C22 |
Pin Count | 2 |
Impedance | 15Ohm |
Element Configuration | Single |
Diode Type | ZENER DIODE |
Current - Reverse Leakage @ Vr | 1μA @ 16V |
Power Dissipation | 3W |
Voltage - Forward (Vf) (Max) @ If | 1.2V @ 500mA |
Max Reverse Leakage Current | 1μA |
Impedance-Max | 6Ohm |
Test Current | 25mA |
Breakdown Voltage | 23.3V |
Zener Voltage | 22V |
Voltage Tolerance | 6% |
ESD Protection | No |
Height | 2.3mm |
Length | 4.5mm |
Width | 2.8mm |
RoHS Status | ROHS3 Compliant |