Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | DO-214AC, SMA |
Number of Pins | 2 |
Diode Element Material | SILICON |
Packaging | Tape & Reel (TR) |
Published | 2013 |
Tolerance | ±6% |
JESD-609 Code | e3 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Max Operating Temperature | 150°C |
Min Operating Temperature | -65°C |
HTS Code | 8541.10.00.50 |
Max Power Dissipation | 1.25W |
Terminal Position | DUAL |
Terminal Form | C BEND |
Peak Reflow Temperature (Cel) | 260 |
Base Part Number | BZG03C82 |
Pin Count | 2 |
Working Voltage | 82V |
Impedance | 100Ohm |
Element Configuration | Single |
Diode Type | ZENER DIODE |
Current - Reverse Leakage @ Vr | 1μA @ 62V |
Power Dissipation | 3W |
Voltage - Forward (Vf) (Max) @ If | 1.2V @ 500mA |
Max Reverse Leakage Current | 1μA |
Impedance-Max | 100Ohm |
Test Current | 10mA |
Breakdown Voltage | 87V |
Forward Voltage | 1.2V |
Zener Voltage | 82V |
Peak Reverse Current | 1μA |
Voltage Tolerance | 6% |
ESD Protection | No |
Height | 2.2098mm |
Length | 4.4958mm |
Width | 2.794mm |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |