BZV55-B30,115
| Parameters | |
|---|---|
| Number of Pins | 2 |
| Diode Element Material | SILICON |
| Operating Temperature | -65°C~200°C |
| Packaging | Tape & Reel (TR) |
| Published | 2003 |
| Tolerance | ±2% |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| ECCN Code | EAR99 |
| HTS Code | 8541.10.00.50 |
| Max Power Dissipation | 500mW |
| Technology | ZENER |
| Terminal Position | END |
| Terminal Form | WRAP AROUND |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | BZV55-B30 |
| Pin Count | 2 |
| Number of Elements | 1 |
| Polarity | UNIDIRECTIONAL |
| Impedance | 80Ohm |
| Element Configuration | Single |
| Diode Type | ZENER DIODE |
| Current - Reverse Leakage @ Vr | 50nA @ 700mV |
| Power Dissipation | 500mW |
| Voltage - Forward (Vf) (Max) @ If | 900mV @ 10mA |
| Case Connection | ISOLATED |
| Max Reverse Leakage Current | 50nA |
| Impedance-Max | 80Ohm |
| Test Current | 2mA |
| Reference Voltage | 30V |
| Zener Voltage | 30V |
| Voltage Tol-Max | 2% |
| Voltage Tolerance | 2% |
| ESD Protection | No |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Contact Plating | Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | DO-213AC, MINI-MELF, SOD-80 |
See Relate Datesheet
