Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | DO-213AC, MINI-MELF, SOD-80 |
Number of Pins | 2 |
Diode Element Material | SILICON |
Operating Temperature | -65°C~200°C |
Packaging | Tape & Reel (TR) |
Published | 2010 |
Tolerance | ±5% |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
HTS Code | 8541.10.00.50 |
Max Power Dissipation | 500mW |
Technology | ZENER |
Terminal Position | END |
Terminal Form | WRAP AROUND |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Base Part Number | BZV55C13 |
Pin Count | 2 |
Number of Elements | 1 |
Polarity | UNIDIRECTIONAL |
Voltage | 13V |
Impedance | 30Ohm |
Element Configuration | Single |
Current | 25A |
Diode Type | ZENER DIODE |
Current - Reverse Leakage @ Vr | 100nA @ 8V |
Power Dissipation | 500mW |
Voltage - Forward (Vf) (Max) @ If | 900mV @ 10mA |
Case Connection | ISOLATED |
Max Reverse Leakage Current | 100nA |
Impedance-Max | 30Ohm |
Test Current | 5mA |
Reference Voltage | 13V |
Zener Voltage | 13.25V |
Voltage Tolerance | 5% |
ESD Protection | No |
RoHS Status | ROHS3 Compliant |