Parameters | |
---|---|
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | SOD-882 |
Number of Pins | 2 |
Diode Element Material | SILICON |
Operating Temperature | -65°C~150°C |
Packaging | Tape & Reel (TR) |
Tolerance | ±5% |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
HTS Code | 8541.10.00.50 |
Max Power Dissipation | 250mW |
Technology | ZENER |
Terminal Position | BOTTOM |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 40 |
Base Part Number | BZX884C75 |
Pin Count | 2 |
Number of Elements | 1 |
Working Voltage | 75V |
Polarity | UNIDIRECTIONAL |
Impedance | 255Ohm |
Element Configuration | Single |
Diode Type | ZENER DIODE |
Current - Reverse Leakage @ Vr | 50nA @ 52.5V |
Power Dissipation | 250mW |
Voltage - Forward (Vf) (Max) @ If | 900mV @ 10mA |
Max Reverse Leakage Current | 50nA |
Impedance-Max | 255Ohm |
Test Current | 2mA |
Reference Voltage | 75V |
Forward Voltage | 900mV |
Zener Voltage | 75V |
Voltage Tol-Max | 5% |
Peak Reverse Current | 50nA |
Voltage Tolerance | 5% |
ESD Protection | Yes |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Factory Lead Time | 1 Week |