Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mounting Type | Through Hole |
Package / Case | TO-247-4 |
Surface Mount | NO |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tube |
Published | 2016 |
Series | C3M™ |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 4 |
Technology | SiCFET (Silicon Carbide) |
Terminal Position | SINGLE |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Reference Standard | IEC-60747-8-4 |
JESD-30 Code | R-PSFM-T4 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 83W Tc |
Operating Mode | ENHANCEMENT MODE |
Case Connection | DRAIN |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 155m Ω @ 15A, 15V |
Vgs(th) (Max) @ Id | 3.5V @ 3mA |
Input Capacitance (Ciss) (Max) @ Vds | 350pF @ 600V |
Current - Continuous Drain (Id) @ 25°C | 22A Tc |
Gate Charge (Qg) (Max) @ Vgs | 21.5nC @ 15V |
Drain to Source Voltage (Vdss) | 1000V |
Drive Voltage (Max Rds On,Min Rds On) | 15V |
Vgs (Max) | ±15V |
Drain Current-Max (Abs) (ID) | 22A |
Drain-source On Resistance-Max | 0.155Ohm |
Pulsed Drain Current-Max (IDM) | 50A |
DS Breakdown Voltage-Min | 1000V |
RoHS Status | RoHS Compliant |