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C8108-04

CONN IC DIP SOCKET 8POS TIN


  • Manufacturer: Aries Electronics
  • Nocochips NO: 90-C8108-04
  • Package: -
  • Datasheet: PDF
  • Stock: 317
  • Description: CONN IC DIP SOCKET 8POS TIN (Kg)

Details

Tags

Parameters
Contact Material Bronze
Mount Wire
Mounting Type Through Hole
Housing Material Polyamide (PA46), Nylon 4/6, Glass Filled
Number of Positions or Pins (Grid) 8 (2 x 4)
Contact Material - Mating Phosphor Bronze
Contact Material - Post Phosphor Bronze
Operating Temperature -55°C~105°C
Packaging Bulk
Published 2009
Series Edge-Grip™, C81
JESD-609 Code e3
Feature Closed Frame
Part Status Obsolete
Moisture Sensitivity Level (MSL) Not Applicable
Termination Wire Wrap
ECCN Code EAR99
Type DIP, 0.3 (7.62mm) Row Spacing
Number of Positions 8
Number of Rows 2
Additional Feature STANDARD: UL 94V-0
Contact Finish - Mating Tin
Current Rating (Amps) 1.5A
Pitch - Mating 0.100 2.54mm
Lead Pitch 2.54mm
Number of Contacts 8
PCB Contact Pattern RECTANGULAR
Body Breadth 0.4 inch
Contact Style SQ PIN-SKT
Insulation Resistance 1000000000Ohm
Mating Contact Pitch 0.1 inch
Dielectric Withstanding Voltage 1000VAC V
PCB Contact Row Spacing 0.3 mm
Termination Post Length 0.675 17.15mm
Pitch - Post 0.100 2.54mm
Height 7.11mm
Length 11.6mm
Width 10.2mm
Contact Finish Thickness - Mating 200.0μin 5.08μm
Contact Finish Thickness - Post 200.0μin 5.08μm
Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Lead Free Contains Lead
See Relate Datesheet

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