banner_page

C8118-04

CONN IC DIP SOCKET 18POS TIN


  • Manufacturer: Aries Electronics
  • Nocochips NO: 90-C8118-04
  • Package: -
  • Datasheet: PDF
  • Stock: 959
  • Description: CONN IC DIP SOCKET 18POS TIN (Kg)

Details

Tags

Parameters
Contact Material Bronze
Mount Wire
Mounting Type Through Hole
Housing Material Polyamide (PA46), Nylon 4/6, Glass Filled
Number of Positions or Pins (Grid) 18 (2 x 9)
Contact Material - Mating Phosphor Bronze
Contact Material - Post Phosphor Bronze
Operating Temperature -55°C~105°C
Packaging Bulk
Published 2007
Series Edge-Grip™, C81
JESD-609 Code e3
Feature Closed Frame
Part Status Obsolete
Moisture Sensitivity Level (MSL) Not Applicable
Termination Wire Wrap
ECCN Code EAR99
Type DIP, 0.3 (7.62mm) Row Spacing
Number of Positions 18
Number of Rows 2
Additional Feature STANDARD: UL 94V-0
Contact Finish - Mating Tin
Current Rating (Amps) 1.5A
Pitch - Mating 0.100 2.54mm
Lead Pitch 2.54mm
Number of Contacts 18
PCB Contact Pattern RECTANGULAR
Body Breadth 0.4 inch
Contact Style SQ PIN-SKT
Insulation Resistance 1000000000Ohm
Mating Contact Pitch 0.1 inch
Dielectric Withstanding Voltage 1000VAC V
PCB Contact Row Spacing 0.3 mm
Termination Post Length 0.675 17.15mm
Pitch - Post 0.100 2.54mm
Height 7.11mm
Length 24.5mm
Width 10.2mm
Contact Finish Thickness - Mating 200.0μin 5.08μm
Contact Finish Thickness - Post 200.0μin 5.08μm
Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Lead Free Contains Lead
See Relate Datesheet

Write a review

Note: HTML is not translated!
    Bad           Good