Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 3-SMD, No Lead |
Packaging | Tape & Reel (TR) |
Published | 2008 |
Series | TBU® |
JESD-609 Code | e3 |
Part Status | Discontinued |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 3 |
Termination | SMD/SMT |
Resistance | 11Ohm |
Max Operating Temperature | 85°C |
Min Operating Temperature | -40°C |
Applications | General Purpose |
Voltage - Rated | 14V |
Technology | Internal Switch |
Terminal Position | BOTTOM |
Terminal Form | BUTT |
Peak Reflow Temperature (Cel) | 260 |
Number of Functions | 1 |
Current Rating | 180mA |
Time@Peak Reflow Temperature-Max (s) | 40 |
Base Part Number | C850 |
Pin Count | 3 |
JESD-30 Code | R-XBCC-B3 |
Qualification Status | Not Qualified |
Temperature Grade | INDUSTRIAL |
Number of Circuits | 1 |
Output Current | 360mA |
Response Time | 1 μs |
Clamping Voltage | 850V |
Max Surge Current | 180mA |
Telecom IC Type | SURGE PROTECTION CIRCUIT |
Voltage - Working | 425V |
Height | 850μm |
Length | 8.25mm |
Width | 4mm |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |