CBR08C509B1GAC
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount, MLCC |
| Package / Case | 0805 (2012 Metric) |
| Terminal Shape | WRAPAROUND |
| Material | Ceramic |
| Weight | 5.499807mg |
| Operating Temperature | -55°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2016 |
| Series | CBR-SMD RF C0G |
| Size / Dimension | 0.079Lx0.049W 2.00mmx1.25mm |
| Tolerance | ±0.1pF |
| JESD-609 Code | e3 |
| Feature | High Q, Low Loss, Ultra Low ESR |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| Termination | SMD/SMT |
| ECCN Code | EAR99 |
| Temperature Coefficient | C0G NP0 |
| Terminal Finish | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Applications | RF, Microwave, High Frequency |
| HTS Code | 8532.24.00.20 |
| Capacitance | 5pF |
| Voltage - Rated DC | 100V |
| Packing Method | TR, PUNCHED PAPER, 7 INCH |
| Case Code (Metric) | 2012 |
| Case Code (Imperial) | 0805 |
| Dielectric | C0G |
| Temperature Characteristics Code | C0G |
| Multilayer | Yes |
| Height | 950μm |
| Length | 2mm |
| Width | 1.25mm |
| Thickness (Max) | 0.035 0.88mm |
| Thickness | 889μm |
| RoHS Status | ROHS3 Compliant |
CBR08C509B1GAC Overview
The size/dimension of the program on this device is 0.079Lx0.049W 2.00mmx1.25mm.Temperature coefficient of resistance refers to the change in electrical resistance of a substance per degree change in temperature, with C0G NP0 being the highest temperature coefficient.A voltage of 100V can be used for operation.
CBR08C509B1GAC Features
a size/dimension of 0.079Lx0.049W 2.00mmx1.25mm
with C0G NP0 being the highest temperature coefficient
with the voltage - Rated DC of 100V
CBR08C509B1GAC Applications
There are a lot of KEMET CBR08C509B1GAC applications of ceramic capacitors.
- Mobile devices
- Power supply circuit
- General electronic equipment
- Servers, PCs, tablets
