Parameters | |
---|---|
Mounting Type | Through Hole |
Package / Case | 4-SIP |
Surface Mount | NO |
Diode Element Material | SILICON |
Operating Temperature | -65°C~150°C TJ |
Packaging | Bulk |
JESD-609 Code | e3 |
Part Status | Active |
Number of Terminations | 4 |
ECCN Code | EAR99 |
Terminal Finish | Matte Tin (Sn) - with Nickel (Ni) barrier |
Technology | Standard |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-PSIP-T4 |
Number of Elements | 4 |
Configuration | BRIDGE, 4 ELEMENTS |
Diode Type | Single Phase |
Current - Reverse Leakage @ Vr | 10μA @ 100V |
Voltage - Forward (Vf) (Max) @ If | 1V @ 1A |
Output Current-Max | 1.5A |
Current - Average Rectified (Io) | 1.5A |
Number of Phases | 1 |
Non-rep Pk Forward Current-Max | 50A |
Voltage - Peak Reverse (Max) | 100V |
Breakdown Voltage-Min | 100V |
RoHS Status | ROHS3 Compliant |