Parameters | |
---|---|
Mounting Type | Through Hole |
Package / Case | 4-Square, CM |
Surface Mount | NO |
Diode Element Material | SILICON |
Operating Temperature | -65°C~150°C TJ |
Packaging | Bulk |
Published | 2012 |
JESD-609 Code | e0 |
Pbfree Code | no |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 4 |
ECCN Code | EAR99 |
Terminal Finish | Tin/Lead (Sn/Pb) |
HTS Code | 8541.10.00.80 |
Technology | Standard |
Terminal Position | UPPER |
Terminal Form | WIRE |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Reach Compliance Code | not_compliant |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Pin Count | 4 |
JESD-30 Code | S-XUFM-W4 |
Qualification Status | Not Qualified |
Number of Elements | 4 |
Configuration | BRIDGE, 4 ELEMENTS |
Diode Type | Single Phase |
Current - Reverse Leakage @ Vr | 10μA @ 100V |
Voltage - Forward (Vf) (Max) @ If | 1.1V @ 3A |
Output Current-Max | 3A |
Current - Average Rectified (Io) | 6A |
Number of Phases | 1 |
Non-rep Pk Forward Current-Max | 125A |
Reverse Current-Max | 10μA |
Voltage - Peak Reverse (Max) | 100V |
Breakdown Voltage-Min | 100V |
Reverse Test Voltage | 100V |
RoHS Status | Non-RoHS Compliant |